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Layers (層數)
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1-12 (layers)
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Material (材質)
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FR-4, CEM-3 , CEM-1 , FR-2
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Board Thickness (板厚)
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0.2mm ~ 3.2mm (8 mil~126mil)
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Copper thickness (銅厚)
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1/2 oz ~ 3 oz
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Min.
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Min Trace Width & Line Space (最小線寬/線距)
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0.075mm (3mil)
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Min CNC Drill Hole Size (最小孔)
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0.3mm (12mil)
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PTH dia差(鍍通孔公差)
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±0.075mm (3mil)
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NPTH hole dia tolerance (非鍍通孔公差)
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±0.05mm (2mil)
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Hole Position Deviation (孔位偏差)
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±0.075mm (3mil)
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Conductor width tolerance (導線公差)
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±20%
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Outline Tolerance(外形尺寸公差)
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+/-0.125mm(5mil) CNC Routing
±0.15mm (6mil) by punch
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Surface Treatment (表面處理)
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IMM Gold/Nickel/Gold Plating/ Entek/HAL
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Insulation Resistance (絕緣電阻)
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10k ~ 20MΩ
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Warp and Twis(板翹/板曲)
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≤0.7%
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Impedance Control (阻抗控制)
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±5%
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Solder Mask Color(阻焊顏色)
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Green, Red, Black, White, Blue, Yellow
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Silk Screen Color(字符顏色)
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White, Black, Yellow, Red
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Multilayers(多層)
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Layer-layer misregistration(層間偏移)
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0.15mm(6mil)max~
60.25mm(10mil)max
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Min. spacing between hole edge to circuitry pattern of an inner llayer(內層孔距周邊最小間距)
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0.25mm(10mil)
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Min. spacing between board outline to circuitry pattern of an inner layer(內層線路距外形最小距離)
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0.25mm(10mil)
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Board thickness tolerance(板厚公差)
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+/-0.13mm(5mil) ~+/-0.15mm(6mil)
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